Nanotechnology

       
 
             
 

Silicon Nanowires for Nanoelectronics and Thermoelectric Applications

 

Low cost and simple methodology for fabrication of Si nanowires lends itself to simple device design and testing, as the nanowires are laterally etched into silicon, or SOI wafers providing needed isolation for experiments. Process requires only standard, e.g. 1 µm, lithography.

Si nanowires on SOI wafer in ARI process, after only the initial etch.
 

SEMs of lateral nanowire sets after first oxidation. Wires are between 2 pads for testing. Further oxidation thinsdiameters as desired.

 

We are exploring possible thermoelectric, biomedical, electronic, and light-emitting applications. Diameters are chosen by subsequent oxidation thinning. Wires with n-type or p-type or junctions are fabricated.
 

Coaxial nanowires with poly shield have also been fabricated. Poly shield is selectively etched. Bottom right – removed poly shield beads in a nanoscale calculator – Nano-Abacus

 

 

 

V. Milanovic, L. Doherty, “A simple process for lateral single crystal silicon nanowires,” accepted for presentation at IMECE 2002, New Orleans, LA.

 

V. Milanovic, L. Doherty, D. Teasdale, S. Parsa, C. Zhang, and K. Pister, ``Micromachining Technology for Lateral Field Emission Devices,'' IEEE Tran. Electron Devices, vol. 48, no. 1, pp. 166-173, Jan. 2001.