|
Wafer transfer of
MEMS for RF and Sensor Applications |
| |
| RF
Microrelay as fabricated on MEMS wafer |
After
transfer/integration |
| |
 |
|
| |
| After
transfer/integration |
After
transfer/integration |
| |
 |
|
| |
| V.
Milanovic, “RF MEMS Switch Development and Packaging Using a Wafer
Transfer Process,” invited talk, MEMS Workshop, Int. Microwave
Symp., Phoenix, AZ, May 2001. |
| |
| V.
Milanovic, M. Maharbiz, and K. Pister, ``Batch Transfer Integration
of RF Microrelays,''IEEE Microwave and Guided Wave Letters, vol.
10, no. 8, pp. 313-315, Aug. 2000. |
| |
| V.
Milanovic, L. Doherty, D. Teasdale, S. Parsa, C. Zhang, and K.
Pister, ``Micromachining Technology for Lateral Field Emission
Devices,'' IEEE Tran. On Electron Devices - special issue on vacuum
electronics, vol. 48, no. 1, pp. 166-173, Jan. 2001. |
|
